agilent AMMC-2008 dc 50 ghz spdt switch data sheet description agilents AMMC-2008 is a mono- lithic phemt spdt switch with low insertion loss and high isolation from dc to 50 ghz. this mmic is designed for general- purpose applications. one series and two shunt phemts per throw provide 2.0 db insertion loss and 28 db isolation at 40 ghz. features wide frequency range: dc ?50 ghz single pole double throw switch low insertion loss: 2.3 db (max.) at 40 ghz high isolation: 25 db (min.) at 40 ghz medium input power: p -1db : +14 dbm applications instrumentation communications radar ecm ?w fiber optics pulse modulation port isolation transfer switching high speed switching replacement of mechanical switches absolute maximum ratings [1] symbol parameters/conditions units min. max. v sel select voltages 1 & 2 v -8 +1.4 p in rf input power dbm +20 t b die backside temperature c +140 t stg storage temperature c -65 +165 t max max. assembly temp (60 sec max) c +300 note: 1. operation in excess of any one of these conditions may result in permanent damage to this device. chip size: 930 x 630 m (36.6 x 24.8 mils) chip size tolerance: 10 m ( 0.4 mils) chip thickness: 100 10 m (4 0.4 mils) pad dimensions: 80 x 80 m (3.2 x 3.2 mils)
2 AMMC-2008 dc specifications [1] symbol parameters and test conditions units min. typ. max. i sel1 leakage current at v sel1 = +0 v, v sel2 = -3 v a20 i sel1 leakage current at v sel1 = -3 v, v sel2 = +0 v a -20 i sel2 leakage current at v sel2 = +0 v, v sel1 = -3 v a20 i sel2 leakage current at v sel2 = -3 v, v sel1 = +0 v a -20 note: 1. backside temperature t b = 25 c unless otherwise noted. rf specifications [2,3] (z in = z out = 50 ? , v sel1 = -3v, v sel2 = 0v) symbol parameters and test conditions freq. units min. typ. max. il insertion loss, rf in to rf out (on throw) 2 ghz db 1.6 2 25 ghz 1.6 2 40 ghz 2.0 2.3 iso isolation, rf in to rf out (off throw) 2 ghz db 46 49 25 ghz 30 35 40 ghz 25 28 rl in input return loss 2 ghz db 15 16.5 40 ghz 15 23 rl out-on output return loss (on throw) 2 ghz db 15 16.5 40 ghz 15 18 rl out-off output return loss (off throw) 2 ghz db 4.5 40 ghz 4.5 p -1db input power at 1 db gain compression 25 ghz dbm +14 h 2 2nd harmonic, p out = +5 dbm 2 ghz dbc -48 -45 12 ghz -43 -40 h 3 3rd harmonic, p out = +5 dbm 2 ghz dbc -60 -50 12 ghz -60 -50 ip3 input 3rd order intercept point, dbm 2 ghz +27 +32 rf in1 =rf in2 = +5 dbm, ? f = 2 mhz 12 ghz +27 +32 notes: 2. data measured in wafer form, t chuck = 25 c. 3. 100% on-wafer rf test is done at frequency = 2, 10, 20, 30 and 40 ghz, except as noted.
3 AMMC-2008 typical performance (t = 25 c, v sel1 = -3v, v sel2 = 0v) figure 1. insertion loss. frequency (ghz) s21 (db) 050 10 20 30 40 0 -1 -2 -3 -4 -5 figure 2. isolation. frequency (ghz) s31 (db) 050 10 20 30 40 0 -20 -40 -60 -80 figure 3. return loss. frequency (ghz) return loss (db) 0 -5 -10 -15 -20 -25 -30 050 10 20 30 40 s11(db) s22(db) figure 4. gain compression vs. input power. pin (dbm) gain compression (db) 0 -1 -2 -3 -4 -5 -6 -5 25 0 5 10 15 20 2 ghz 12 ghz figure 5. harmonics vs. input power f o =2 ghz. pin (dbm) h1, h2, h3 (dbm) 20 0 -20 -40 -60 -80 -100 -15 25 0 -5 -10 5 10 15 20 h1 (dbm) h2 (dbm) h3 (dbm) figure 6. harmonics vs. input power f o =12 ghz. pin (dbm) h1, h2, h3 (dbm) 20 0 -20 -40 -60 -80 -100 -15 25 0 -5 -10 5 10 15 20 h1 (dbm) h2 (dbm) h3 (dbm) figure 7. intermodulation products vs. pin at f=2 ghz. pin (dbm) intermod products (dbm) 20 0 -20 -40 -60 -80 -100 -15 15 0 -5 -10 5 10 h1 (dbm) im3 (dbm) im5 (dbm) figure 8. intermodulation products vs. pin at f=12 ghz. pin (dbm) intermod products (dbm) 20 0 -20 -40 -60 -80 -100 -15 15 0 -5 -10 5 10 h1 (dbm) im3 (dbm) im5 (dbm)
4 AMMC-2008 typical scattering parameters [1] (t chuck = 25 c, v sel1 = -3 v, v sel2 = 0 v) rf out1: off (terminated in 50-ohms), rf out2: on freq. s 11 s 21 s 12 s 22 ghz db mag phase db mag phase db mag phase db mag phase 1 -16.23 0.154 -8 -1.66 0.826 -3 -1.64 0.828 -3 -16.34 0.152 -10 2 -16.65 0.147 -12 -1.71 0.821 -5 -1.71 0.821 -5 -16.72 0.146 -17 3 -16.83 0.144 -14 -1.73 0.820 -7 -1.72 0.821 -7 -16.91 0.143 -22 4 -17.01 0.141 -18 -1.74 0.819 -9 -1.72 0.820 -9 -17.03 0.141 -29 5 -17.23 0.138 -22 -1.74 0.818 -11 -1.73 0.819 -12 -17.09 0.140 -35 6 -17.38 0.135 -24 -1.72 0.821 -13 -1.70 0.822 -13 -17.34 0.136 -40 7 -17.47 0.134 -28 -1.69 0.823 -16 -1.68 0.824 -16 -17.21 0.138 -46 8 -17.66 0.131 -32 -1.66 0.826 -18 -1.65 0.827 -18 -17.23 0.138 -52 9 -17.96 0.127 -35 -1.62 0.830 -20 -1.65 0.827 -21 -17.44 0.134 -58 10 -18.17 0.123 -37 -1.59 0.833 -23 -1.60 0.831 -23 -17.46 0.134 -61 11 -18.41 0.120 -42 -1.60 0.832 -25 -1.62 0.830 -25 -17.34 0.136 -68 12 -18.84 0.114 -44 -1.66 0.826 -27 -1.63 0.829 -28 -17.71 0.130 -73 13 -18.72 0.116 -45 -1.57 0.835 -30 -1.57 0.834 -30 -17.60 0.132 -76 14 -19.23 0.109 -49 -1.59 0.833 -32 -1.60 0.832 -33 -17.66 0.131 -83 15 -19.04 0.112 -51 -1.50 0.842 -35 -1.54 0.837 -35 -17.53 0.133 -84 16 -19.14 0.110 -56 -1.46 0.845 -37 -1.51 0.841 -37 -17.31 0.136 -89 17 -19.49 0.106 -60 -1.50 0.841 -40 -1.52 0.840 -40 -17.48 0.134 -96 18 -19.62 0.105 -65 -1.56 0.836 -43 -1.47 0.845 -43 -17.21 0.138 -99 19 -19.95 0.101 -68 -1.56 0.835 -45 -1.52 0.839 -45 -17.22 0.138 -104 20 -20.35 0.096 -71 -1.48 0.843 -48 -1.54 0.838 -48 -17.16 0.139 -109 21 -20.25 0.097 -75 -1.47 0.844 -50 -1.51 0.840 -50 -17.16 0.139 -113 22 -20.49 0.095 -80 -1.49 0.842 -53 -1.53 0.838 -53 -17.11 0.139 -118 23 -20.88 0.090 -83 -1.51 0.840 -55 -1.54 0.837 -56 -16.98 0.142 -122 24 -21.54 0.084 -88 -1.57 0.835 -58 -1.58 0.833 -58 -16.96 0.142 -126 25 -21.60 0.083 -93 -1.57 0.834 -61 -1.56 0.836 -60 -16.96 0.142 -131 26 -21.64 0.083 -98 -1.55 0.837 -63 -1.51 0.840 -63 -16.88 0.143 -135 27 -21.32 0.086 -100 -1.59 0.832 -66 -1.51 0.841 -66 -16.92 0.143 -140 28 -21.58 0.083 -108 -1.55 0.837 -68 -1.54 0.837 -68 -16.82 0.144 -144 29 -22.10 0.079 -113 -1.58 0.833 -71 -1.58 0.833 -71 -16.83 0.144 -149 30 -22.02 0.079 -120 -1.58 0.833 -74 -1.61 0.831 -73 -16.81 0.144 -155 31 -22.09 0.079 -127 -1.63 0.829 -76 -1.55 0.836 -76 -16.83 0.144 -160 32 -21.66 0.083 -131 -1.75 0.818 -79 -1.53 0.839 -79 -16.84 0.144 -166 33 -21.85 0.081 -139 -1.64 0.828 -81 -1.62 0.830 -82 -16.82 0.144 -168 34 -22.36 0.076 -146 -1.58 0.834 -84 -1.64 0.828 -84 -16.83 0.144 -174 35 -21.91 0.080 -156 -1.60 0.832 -87 -1.64 0.828 -87 -16.75 0.145 180 36 -21.19 0.087 -162 -1.66 0.826 -90 -1.63 0.829 -90 -16.74 0.146 174 37 -20.74 0.092 -168 -1.67 0.825 -93 -1.64 0.828 -93 -16.67 0.147 166 38 -20.81 0.091 -174 -1.67 0.825 -94 -1.63 0.829 -95 -16.78 0.145 161 39 -20.63 0.093 175 -1.69 0.823 -98 -1.63 0.829 -98 -16.68 0.147 154 40 -19.95 0.101 165 -1.69 0.823 -101 -1.65 0.827 -101 -16.80 0.145 145 41 -19.16 0.110 162 -1.75 0.818 -104 -1.68 0.824 -104 -16.84 0.144 138 42 -19.26 0.109 158 -1.67 0.825 -107 -1.75 0.817 -107 -17.08 0.140 129 43 -19.29 0.108 153 -1.63 0.828 -110 -1.78 0.815 -110 -17.13 0.139 122 44 -19.00 0.112 144 -1.58 0.833 -113 -1.75 0.818 -113 -17.32 0.136 115 45 -18.09 0.125 137 -1.97 0.797 -117 -1.75 0.817 -116 -17.20 0.138 105 46 -17.09 0.140 137 -2.01 0.793 -119 -1.89 0.805 -119 -17.04 0.141 96 47 -17.08 0.140 134 -1.81 0.812 -121 -1.96 0.798 -123 -17.23 0.138 88 48 -16.94 0.142 128 -1.62 0.830 -124 -2.00 0.795 -125 -17.59 0.132 81 49 -16.32 0.153 122 -1.71 0.821 -129 -1.96 0.798 -127 -17.23 0.138 75 50 -15.74 0.163 115 -1.81 0.812 -134 -1.87 0.807 -131 -16.86 0.144 63 note: 1. data obtained from on-wafer measurements.
5 AMMC-2008 typical scattering parameters [1] (t chuck = 25 c, v sel1 = 0v, v sel2 = -3v) rf out1: on, rf out2: off (terminated in 50-ohms) freq. s 11 s 21 s 12 s 22 ghz db mag phase db mag phase db mag phase db mag phase 1 -15.47 0.168 -7 -53.97 0.002 94 -54.90 0.002 102 -4.66 0.585 178 2 -15.80 0.162 -14 -49.29 0.003 90 -49.25 0.003 90 -4.63 0.587 176 3 -16.20 0.155 -19 -45.20 0.005 86 -45.17 0.006 84 -4.58 0.590 174 4 -16.77 0.145 -24 -42.97 0.007 79 -43.04 0.007 78 -4.52 0.594 172 5 -17.21 0.138 -26 -41.36 0.009 73 -41.65 0.008 73 -4.44 0.600 170 6 -17.29 0.137 -28 -39.87 0.010 74 -39.74 0.010 73 -4.36 0.605 167 7 -17.22 0.138 -32 -38.16 0.012 65 -38.21 0.012 65 -4.29 0.610 165 8 -17.78 0.129 -38 -38.42 0.012 60 -38.37 0.012 61 -4.22 0.615 162 9 -18.23 0.123 -39 -37.60 0.013 58 -37.43 0.013 60 -4.15 0.620 159 10 -17.84 0.128 -40 -37.25 0.014 58 -36.97 0.014 58 -4.09 0.624 157 11 -17.76 0.129 -51 -36.70 0.015 52 -36.70 0.015 53 -4.04 0.628 154 12 -18.94 0.113 -59 -36.35 0.015 54 -36.50 0.015 54 -4.00 0.631 151 13 -20.14 0.098 -54 -36.41 0.015 53 -36.33 0.015 53 -3.97 0.633 148 14 -19.90 0.101 -51 -36.38 0.015 54 -36.31 0.015 54 -3.96 0.634 145 15 -18.88 0.114 -54 -35.72 0.016 47 -35.32 0.017 47 -3.94 0.635 142 16 -18.46 0.119 -65 -35.61 0.017 42 -35.49 0.017 44 -3.95 0.635 139 17 -18.70 0.116 -77 -35.90 0.016 42 -35.62 0.017 44 -3.95 0.635 136 18 -19.74 0.103 -87 -36.35 0.015 42 -36.51 0.015 40 -3.96 0.634 133 19 -21.80 0.081 -97 -37.22 0.014 46 -37.14 0.014 44 -3.99 0.632 130 20 -25.02 0.056 -90 -37.44 0.013 48 -37.33 0.014 48 -4.01 0.630 127 21 -23.45 0.067 -73 -37.49 0.013 47 -37.13 0.014 50 -4.03 0.629 124 22 -21.47 0.084 -82 -37.20 0.014 49 -37.01 0.014 50 -4.07 0.626 122 23 -21.65 0.083 -96 -38.25 0.012 52 -38.04 0.013 52 -4.11 0.623 119 24 -22.59 0.074 -106 -38.34 0.012 60 -38.34 0.012 59 -4.17 0.619 116 25 -22.63 0.074 -115 -38.35 0.012 68 -38.11 0.012 66 -4.17 0.619 113 26 -23.52 0.067 -132 -37.89 0.013 75 -37.42 0.013 74 -4.22 0.615 110 27 -27.01 0.045 -138 -36.88 0.014 83 -36.76 0.015 82 -4.26 0.613 107 28 -28.96 0.036 -108 -36.46 0.015 82 -36.14 0.016 82 -4.27 0.612 105 29 -24.73 0.058 -108 -35.27 0.017 84 -35.25 0.017 83 -4.31 0.609 101 30 -23.06 0.070 -137 -35.16 0.017 87 -35.00 0.018 86 -4.33 0.607 99 31 -23.94 0.064 -161 -34.51 0.019 93 -34.27 0.019 91 -4.37 0.605 96 32 -25.49 0.053 -167 -33.58 0.021 99 -33.56 0.021 91 -4.38 0.604 93 33 -25.94 0.050 180 -32.38 0.024 98 -32.74 0.023 95 -4.43 0.601 90 34 -28.94 0.036 152 -31.34 0.027 93 -31.68 0.026 94 -4.45 0.599 87 35 -40.23 0.010 119 -31.18 0.028 95 -31.04 0.028 96 -4.49 0.596 84 36 -27.64 0.041 -114 -30.30 0.031 95 -30.18 0.031 94 -4.52 0.594 81 37 -21.32 0.086 -148 -29.79 0.032 96 -29.50 0.034 91 -4.52 0.594 78 38 -20.15 0.098 175 -28.94 0.036 92 -29.27 0.034 90 -4.58 0.590 75 39 -22.12 0.078 144 -28.77 0.036 96 -28.93 0.036 93 -4.58 0.590 73 40 -24.36 0.061 144 -28.03 0.040 92 -28.05 0.040 91 -4.57 0.591 69 41 -21.84 0.081 155 -27.57 0.042 94 -27.62 0.042 91 -4.61 0.588 66 42 -21.32 0.086 140 -26.55 0.047 91 -26.98 0.045 91 -4.62 0.588 63 43 -24.37 0.060 129 -26.08 0.050 87 -26.38 0.048 90 -4.64 0.586 61 44 -24.69 0.058 147 -25.07 0.056 83 -25.67 0.052 87 -4.70 0.582 57 45 -19.69 0.104 143 -26.09 0.050 84 -25.23 0.055 85 -4.68 0.583 54 46 -17.83 0.128 129 -25.55 0.053 86 -25.02 0.056 83 -4.65 0.586 52 47 -19.34 0.108 122 -23.64 0.066 86 -24.44 0.060 81 -4.67 0.584 49 48 -20.09 0.099 122 -22.36 0.076 81 -24.04 0.063 79 -4.68 0.583 46 49 -19.24 0.109 117 -22.70 0.073 74 -23.62 0.066 79 -4.70 0.582 43 50 -19.75 0.103 114 -22.76 0.073 66 -23.00 0.071 76 -4.66 0.585 39 note: 1. data obtained from on-wafer measurements.
6 figure 9. AMMC-2008 schematic. operation the rf input and output ports may be dc or ac-coupled. if dc-coupled, the voltages on the input and output ports must be 0 0.25 volts for guaranteed switch performance. assembly techniques the chip should be attached directly to the ground plane using either a fluxless ausn solder preform or electrically conductive epoxy [1] .for conduc- tive epoxy, the amount should be just enough to provide a thin fillet around the bottom perim- eter of the die. the ground plane should be free of any residue that may jeopardize electrical or mechanical attachment. caution should be taken to not exceed the absolute maximum rating for assembly temperature and time. thermosonic wedge bonding is the preferred method for wire attachment to the bond pads. the rf connections should be kept as short as possible to minimize inductance. gold mesh [2] or double-bonding with 0.7 mil gold wire is recommended. mesh can be attached using a 2 mil round tracking tool and a tool force of approximately 22 grams with an ultrasonic power of roughly 55 db for a duration of 76 8 ms. a guided wedge at an ultrasonic power level of 64 db can be used for the 0.7 mil wire. the recommended wire bond stage temperature is 150 2 c. recommended operation conditions v sel1 v sel2 rf out1 rf out2 0.6>0> -0.4 -3.5 > -3 > -2.5 on off -3.5 > -3 > -2.5 0. 6>0> -0.4 off on 0.6>0> -0.4 0. 6>0> -0.4 off off -3.5 > -3 > -2.5 -3.5 > -3 > -2.5 off off figure 10. biasing diagram. rf output 1 rf input rf output 2 vsel 2 vsel 1 rf input rf out p ut 1 rf output 2 vsel 1 vsel 2
figure 11. chip bias/rf bond pad locations. (dimensions in micrometers) www.agilent.com/semiconductors for product information and a complete list of distributors, please go to our web site. for technical assistance call: americas/canada: +1 (800) 235-0312 or (916) 788-6763 europe: +49 (0) 6441 92460 china: 10800 650 0017 hong kong: (65) 6756 2394 india, australia, new zealand: (65) 6755 1939 japan: (+81 3) 3335-8152(domestic/international), or 0120-61-1280(domestic only) korea: (65) 6755 1989 singapore, malaysia, vietnam, thailand, philippines, indonesia: (65) 6755 2044 taiwan: (65) 6755 1843 data subject to change. copyright ? 2003 agilent technologies, inc. august 5, 2003 5988-9885en figure 12. chip assembly diagram. 630 545 100 285 rf_i rf_01 vsel2 vsel1 rf_02 285 834 465 96 930 265 665 rf in rf out1 rf out2 v sel1 v sel2 rf_01 rf_1 rf_02 >68 pf chip capacitor the chip is 100 mm thick and should be handled with care. this mmic has exposed air bridges on the top surface. handle at edges or with a custom collet (do not pick up die with vacuum on die center.) this mmic is also static sensitive and esd handling precautions should be taken. for more information, see agilent application note 54 gaas mmic esd, die attach and bonding guidelines. notes: 1. ablebond 84-1 lm1 silver epoxy is recommended. 2. buckbee-mears corporation, st. paul, mn, 800-262-3824
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